Thermal design of a sensor for building control equipped with QFN electronic devices subjected to free convection. Effects of the encapsulating resin
- Egileak:
- A. Baïri, N. Nithyadevi, I. Baïri, A. Martin-Garín, J.A. Millán-García
- Urtea:
- 2017
- Aldizkaria:
- Energy & Buildings
- Liburukia:
- 141
- Hasierako orria - Amaierako orria:
- 218 - 225