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Natural convective cooling of electronics contained in tilted hemispherical enclosure filled with a porous medium saturated by water-copper nanofluid

Authors:
A. Baïri, J.G. Bauzin, A. Martín-Garín, N. Alilat, J.A. Millán-García
Year:
2019
Journal:
International Journal of Numerical Methods for Heat and Fluid Flow
Volume:
29(1)
Initial page - Ending page:
280 - 293
DOI:
https://doi.org/10.1108/HFF-01-2018-0036

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